![]() ![]() The easiest to use is approximately 60% tin and 40% lead. Solder paste is available in a variety of mixtures of metal. Then there is the selection of soldering paste. SMD Soldering – Manual Pick And Place – PCB Microscope As a result of all these variables, hot-air soldering becomes very personalized-each person develops their own “style” of working. With a little practice, hot-air soldering is not particularly difficult, but each person must find the balance of temperature, air flow, nozzle size, and gun movement that works for them. Care should be taken to aim the nozzle toward the pins/pads being soldered while avoiding the bodies of the components as much as possible. Ideally, the hot-air gun should be held so that the nozzle opening is perpendicular to the surface of the PCB and approximately 12mm (0.5″) above it. In addition to time and temperature, a handheld hot-air gun involves several other factors, including the size of the nozzle, how far the nozzle is held from the solder, the angle of the airflow from the nozzle to the solder, the speed of the air coming from the nozzle, the speed at which the nozzle is moved around over the areas to be soldered. The challenge is that there are more variables in play when using a hot-air station. ![]() Bring the Nozzle of Blower close to the Circuit board and wait until the Solder paste melts and fuses with the IC Pins. After placing the components on the Circuit Board, set the rework station to required temperature and Air Speed. For the hobbyist, there are two primary methods of applying solder paste to a PCB for surface mount devices: by hand with a syringe or a very small spatula (think wooden toothpick) and by hand with a stencil. After thoroughly cleaning the bare PCB with alcohol, the next step is solder application. Hot Air Re-flow Soldering Station is a reliable tool and is not very expensive compared to Re-flow ovens. The best way to solder surface mount devices (SMDs) onto printed circuit boards (PCBs) is with a reflow oven, but when that’s not possible, a hot-air station can be successfully used. Because it can take up to around three minutes to complete the soldering and there is no temperature, control this can be problematic to some components. The Solder paste melts somewhere around 180 degree Celsius to 220 degree Celsius. Turn On the hot plate and wait until the Solder paste melts and take out the board immediately after melt-down of solder paste. Place all the surface mount components and placed the Board on the Hot Plate. If you don’t have re-flow oven, there are also DIY alternatives. Industries use re-flow ovens with temperature profile Control to mass produce circuit boards. But when it comes to soldering SMD components it requires a little bit of skill and some tools and accessories. Apply some flux, Heat the surface and apply solder. Electronics Design, Product tests, Prototyping. ![]()
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